TSSE3U45 RVG Tech Spezifikatioune
Taiwan Semiconductor Corporation - TSSE3U45 RVG technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Taiwan Semiconductor Corporation - TSSE3U45 RVG
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Taiwan Semiconductor | |
| Voltage - Viru (Vf) (Max) @ Wann | 470 mV @ 3 A | |
| Voltage - DC Reverse (Vr) (Max) | 45 V | |
| Technologie | Schottky | |
| Supplier Device Package | SOD-123HE | |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | |
| Serie | - | |
| Package / Case | SOD-123H |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Package protegéieren | Tape & Reel (TR) | |
| Operatiounstemperatur - Junction | -55°C ~ 150°C | |
| Mounting Type | Surface Mount | |
| Aktuell - Reverse Leakage @ Vr | 1 mA @ 45 V | |
| Aktuell - duerchschnëttlech rektifizéiert (Io) | 3A | |
| Capacitance @ Vr, F. | - | |
| Basis Produktnummer | TSSE3 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Taiwan Semiconductor Corporation TSSE3U45 RVG.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | TSSE3U45 RVG | TSSD20L100SW | TSSA5U60 E3G | TSSA3U60E3G |
| Hiersteller | Taiwan Semiconductor Corporation | Taiwan Semiconductor Corporation | TSC (Taiwan Semiconductor) | Taiwan Semiconductor |
| Aktuell - duerchschnëttlech rektifizéiert (Io) | 3A | 20A | 5A | - |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery = 200mA (Io) | - |
| Voltage - Viru (Vf) (Max) @ Wann | 470 mV @ 3 A | 870 mV @ 20 A | 560mV @ 5A | - |
| Supplier Device Package | SOD-123HE | TO-252, (D-Pak) | DO-214AC (SMA) | - |
| Capacitance @ Vr, F. | - | 1000pF @ 4V, 1MHz | - | - |
| Voltage - DC Reverse (Vr) (Max) | 45 V | 100 V | 60V | - |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | - |
| Operatiounstemperatur - Junction | -55°C ~ 150°C | -55°C ~ 150°C | -55°C ~ 150°C | - |
| Aktuell - Reverse Leakage @ Vr | 1 mA @ 45 V | 50 µA @ 100 V | 300µA @ 60V | - |
| Technologie | Schottky | Schottky | - | - |
| Package / Case | SOD-123H | TO-252-3, DPak (2 Leads + Tab), SC-63 | DO-214AC, SMA | - |
| Basis Produktnummer | TSSE3 | TSSD20 | - | - |
| Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | - | - |
| Serie | - | - | - | - |
Eroflueden TSSE3U45 RVG PDF DataDhusts an Taiwan Semiconductor Corporation Dokumentatioun fir TSSE3U45 RVG - Taiwan Semiconductor Corporation.
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|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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